Pot for Semiconductor Packaging
POT (Ultra Fine Grain Carbide/Micro Fine Carbide) ・Processing Example・
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Standard Production Sizes (Please contact us on the outsizes)
- Pot (I.D.)：
- Manual Mold： ４４．０～６５．０ｍｍ Ｍulti-Gang-Pot(MGP) Mold/Auto-Mold： １０．５～２１．０ｍｍ